The growing demand for semiconductor products, such as chips, from the automotive & industrial sectors, is expected to bolster the growth of the semiconductor bonding market. The automotive market registered a growth of 34.9% in 2021. Further, wireless communications, dominated by smartphones, had a growth of 24.6%. The number of 5G handsets produced grew from 251 million units in 2020 to 556 million in 2021, according to the Semiconductor Today data. Further, the rising demand for wearables, smartphones, and 5G services is anticipated to fuel the demand for semiconductor bonding market growth over the forecast period.

Several semiconductor bonding players are adopting various organic and inorganic strategies to gain a competitive advantage. For instance, in April 2021, ASM Pacific Technology introduced three new manufacturing systems with X-Celeprint’s Micro Transfer Printing and ASM AMICRA’s high precision die bonding technology to allow high volume heterogeneous integration of ultra-thin dies.

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According to our latest market study, titled "Semiconductor Bonding Market Forecast to 2028 –Global Analysis – by Type and Application," the market is expected to grow from US$ 669.48 million in 2022 to reach US$ 1,076.82 million by 2028; it is anticipated to grow at a CAGR of 8.2% from 2022 to 2028.

Key Findings of Semiconductor Bonding Market Study

The UAE has the biggest automotive market in the Middle East & Africa. Dubai has been a key automotive hub for the exports and re-exports of vehicles across the region. Advanced infrastructure, ease of conducting business, conducive policies, and available industrial space, along with the existing local demand for luxury vehicles, are contributing to the growth of the automotive industry in the country. Also, various leading auto manufacturers have established their presence in the country, leading to the growth of the automotive industry in the UAE. As a result, the demand for semiconductors in the country has increased, which is boosting the semiconductor bonding market share in global market.

Impact of COVID-19 Pandemic on Semiconductor Bonding Market

During the semiconductor bonding market analysis, it has been observed that COVID-19 pandemic has resulted in a slowdown in the production of electronics, automotive, etc. Travel restrictions, supply chain disruptions, and reduced demand for automobiles have drastically impacted the demand-supply dynamics of semiconductor chips across the regions.

Semiconductor Bonding Market Study: Type Overview

Based on application, the semiconductor bonding market is segmented into RF devices, MEMS and sensors, LED, CMOS image sensors, and 3D NAND. The MEMS and sensors segment dominated the market in 2021 and is expected to grow at the highest CAGR. Semiconductor bonding finds a wide range of applications in micro-electro-mechanical systems (MEMS), sensors, integrated circuits, power electronics, and micro/nanofluidics. The rising adoption of wafer bonding technology in the development of MEMS, optoelectronics, sensors, and high-power electronics is expected to fuel the growth of the MEMS and sensors segment.

Semiconductor Bonding Market Study: Regional Overview

In North America, technological innovations, including artificial intelligence (AI), are projected to provide new growth opportunities for semiconductor bonding companies due to the rising requirement for memory chips in electronic components. Further, the rising demand for technological advancements in the automotive industry, including vehicle electrification, the development of self-driving cars, and advanced driver assisted systems (ADAS), is also growing. In addition, the rising trend of in-house chip design is anticipated to boost investment in semiconductor technology in the US. For instance, a few leading technology leaders, such as Apple, Amazon, and Google, have established their in-house chip design facilities. Thus, all these key factors are estimated to boost the North America semiconductor bonding market growth. This also allows these companies to innovate and develop new smart IoT and AI-enabled products.

Palomar Technologies; Panasonic Corporation; Toray Industries Inc; Kulicke & Soffa Industries, Inc.; HUTEM; DIAS Automation (HK) Ltd; ASMPT Ltd (formerly ASM Pacific Technology Ltd.); EV Group; Yamaha Motor Corporation (Yamaha Robotics Holdings); and WestBond, Inc. are a few of the prominent players operating in the semiconductor bonding market.

The overall semiconductor bonding market has been derived using both primary and secondary sources. To begin the semiconductor bonding market analysis, exhaustive secondary research has been conducted using internal and external sources to obtain qualitative and quantitative information related to the semiconductor bonding market. The process also serves the purpose of obtaining an overview and market forecast of the market growth with respect to all market segments. Also, multiple primary interviews with industry participants and commentators have been conducted to validate the data and gain more analytical insights about the topic. Participants of this process include industry experts such as VPs, business development managers, market intelligence managers, national sales managers, and external consultants—such as valuation experts, research analysts, and key opinion leaders—specializing in the semiconductor bonding market.

Save and reduce time carrying out entry-level research by identifying the growth, size, leading players, and segments in the semiconductor bonding market

• Highlights key business priorities in order to assist companies to realign their business strategies

• The key findings and recommendations highlight crucial progressive industry trends in the semiconductor bonding market thereby allowing players across the value chain to develop effective long-term strategies

• Develop/modify business expansion plans by using substantial growth offering developed and emerging markets

• Scrutinize in-depth global market trends and outlook coupled with the factors driving the market, as well as those hindering it

• Enhance the decision-making process by understanding the strategies that underpin commercial interest with respect to client products, segmentation, pricing, and distribution

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Semiconductor Bonding Forecast Up to 2028