Microelectronic packaging technology

Microelectronic packaging technology

materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989

By ASM International Electronic Materials and Processing Congress (2nd 1989 Philadelphia, Pa.)

1989

ISBN 10: 0871703599
ISBN 13: NA
Publisher: ASM International
Author: ASM International Electronic Materials and Processing Congress (2nd 1989 Philadelphia, Pa.)
Publish Date: 1989
Page count: 479
Title: Microelectronic packaging technology
Subtitle: materials and processes : proceedings of the 2nd ASM International Electronic Materials and Processing Congress, Philadelphia, Pennsylvania, USA, 24-28 April 1989
Edition notes: Includes bibliographies. Cover title: Micro electronic packaging technology. "SAN 204-7586"--T.p. verso.
Subjects: Microelectronic packaging, Congresses., Microelectronics, Materials, Congresses., Surface mount technology, Congresses.
Contributions: Shieh, Wei T., ASM International. Electronic Materials and Processing Division.
Publish places: Metals Park, Ohio
Series: NA
Format: NA
Dimensions: NA
Weight: NA
Pagination: xii, 479 p. :
Page count: 479